Microsystem packaging, assembly and testing

In this unit, you’ll cover a broad range of packaging techniques, from traditional methods like leaded and leadless packages, surface mount technology (SMT), and ball grid arrays (BGA), to advanced approaches including 2.5D and 3D packaging, optoelectronics packaging, MEMS and sensor packaging, and memory packaging. You will explore both practical and theoretical aspects of wire bonding, wafer bonding, dicing, and assembly. You will also gain an understanding of key concepts such as reliability analysis, electric shielding, electrostatic discharge, thermal management, and failure analysis under environmental conditions.

Problem-based learning - To deepen your understanding of concepts and principles, you will take on problem-solving tasks either to complete individually or in small group settings.

Research activities - You will develop research skills through structured inquiry, preparing research proposals using a systematic approach and methodologies specific to your discipline.

Active learning - You will participate in interactive workshops and computer laboratories to deepen your knowledge of lecture content through individual or group activities.

Simulation or virtual practice - You will participate in guided, immersive experiences to build relevant skills, knowledge and professional attitudes through simulation or virtual practice.

The minimum total expected workload to achieve the learning outcomes for this unit is 144 hours per semester typically comprising a mixture of 3-6 hours of scheduled learning activities and 6-9 hours of independent study per week. Scheduled activities may include a combination of teacher-directed learning, peer-directed learning and online engagement. Independent study may include associated readings, assessment and preparation for scheduled activities.