Microsystems and semiconductor fabrication

The unit addresses the foundation and practical aspects of semiconductor devices, micro sensors, micro actuators and related microtechnologies. Topics include an in-depth exploration of principles and materials relevant to MEMS and semiconductor devices, electrical and mechanical characterisation, foundational MEMS structures such as cantilever beams, comb structures and semiconductor device patterns for diodes, transistors and CMOS integrated circuits. Microfabrication techniques for semiconductor and MEMS devices, such as photolithography, etching deposition and other essential techniques are covered.

Furthermore, the unit encompasses characterisation techniques for mechanical and electrical studies, assembly, packaging, testing, reliability and environmental impact studies. It involves hands-on laboratory exercises, project work, computer-based simulation and the construction of semiconductor/MEMS devices for potential real-world applications.

Research activities

Online learning

Simulation or virtual practice

The minimum total expected workload to achieve the learning outcomes for this unit is 144 hours per semester typically comprising a mixture of 3-6 hours of scheduled learning activities and 6-9 hours of independent study per week. Scheduled activities may include a combination of teacher-directed learning, peer-directed learning and online engagement. Independent study may include associated readings, assessment and preparation for scheduled activities.